Copper nanoparticles are materials with high electrical conductivity and excellent electromagnetic shielding.
Particle size : 100 nm to 500 nm (Can be produced by product group)
Application : EMI shielding, Nano Cu paste/ink.
Features
① Improve electromagnetic interruption rate:Blocking polyimide film ~40dB and non-woven fabric ~82dB or more.
② Excellent dispersibility of Copper pastes makes it to cater to customers in various field.
③ Can adjust conductivity by customized carbon complexes manufacturing.
Efficient shielding of electromagnetic waves by improving conductivity.
Solar cell, Photo curing device, PCB board, etc.
